Get started
UUU

T MOBILE USA 21/29

No trades
See on Supercharts
Overview
Analysis

US87264ABS3 chart


Full chart

Key terms


Outstanding amount
‪1.00 B‬ USD
Face value
1,000.00 USD
Minimum denomination
2,000.00 USD
Coupon
2.63% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
5.22%
Maturity date
Feb 15, 2029
Term to maturity
4 years

About T MOBILE USA 21/29


Issuer
T-Mobile USA, Inc.
Sector
Communications
Industry
Wireless Telecommunications
Home page
t-mobile.com
Issue date
Jan 14, 2021
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.

US87264ABS3 analysis


Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.