Amkor Technology, Inc. 6.625% 15-SEP-2027Amkor Technology, Inc. 6.625% 15-SEP-2027Amkor Technology, Inc. 6.625% 15-SEP-2027

Amkor Technology, Inc. 6.625% 15-SEP-2027

No trades
See on Supercharts

Key terms


Outstanding amount
‪525.00 M‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
6.63% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
5.84%
Maturity date
Sep 15, 2027
Term to maturity
2 years

About Amkor Technology, Inc. 6.625% 15-SEP-2027


Sector
Electronic Technology
Industry
Semiconductors
Home page
Issue date
Mar 15, 2019
FIGI
BBG00NKXX285
Amkor Technology, Inc. engages in the provision of outsourced semiconductor packaging and test services. Its services include design, package characterization, test, and wafer bumping services. The company was founded in 1968 and is headquartered in Tempe, AZ.
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.