Search
Products
Community
Markets
News
Brokers
More
EN
Get started
Markets
/
Hong Kong
/
Corporate bonds
/
CLPHF5025189
/
Analysis
C
C
C
CLP Power Hong Kong Financing Ltd. 2.5% 30-JUN-2035
CLPHF5025189
FINRA
CLPHF5025189
FINRA
CLPHF5025189
FINRA
CLPHF5025189
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Analysis
CLPHF5025189 analysis
Overview
Coupon
Redemption
Risks
More
Key facts
Issuer
CLP Power Hong Kong Financing Ltd.
Issue date
Jun 30, 2020
Maturity date
Jun 30, 2035
Outstanding amount
250.00 M
USD
Face value
1,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
2.50% (Fixed)
Yield to maturity
5.29%
CLP Power Hong Kong Financing Ltd. provides financial services. The company is headquartered in British Virgin Islands.
Show more
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.
Start trial