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CLPHF5233005
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Analysis
C
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CLP Power Hong Kong Financing Ltd. 2.25% 21-JUL-2031
CLPHF5233005
FINRA
CLPHF5233005
FINRA
CLPHF5233005
FINRA
CLPHF5233005
FINRA
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Overview
Analysis
CLPHF5233005 analysis
Overview
Coupon
Redemption
Risks
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Key facts
Issuer
CLP Power Hong Kong Financing Ltd.
Issue date
Jul 21, 2021
Maturity date
Jul 21, 2031
Outstanding amount
300.00 M
USD
Face value
1,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
2.25% (Fixed)
Yield to maturity
4.97%
CLP Power Hong Kong Financing Ltd. provides financial services. The company is headquartered in British Virgin Islands.
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