Search
Products
Community
Markets
News
Brokers
More
EN
Get started
Markets
/
Hong Kong
/
Corporate bonds
/
EXLD5224111
E
E
E
Expand Lead Ltd. 4.95% 22-JUL-2026
EXLD5224111
FINRA
EXLD5224111
FINRA
EXLD5224111
FINRA
EXLD5224111
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Analysis
EXLD5224111
chart
Full chart
1 day
5 days
1 month
6 months
Year to date
1 year
5 years
All time
Key terms
Outstanding amount
300.00 M
USD
Face value
1,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
4.95% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
8.38%
Maturity date
Jul 22, 2026
Term to maturity
1 year
About Expand Lead Ltd. 4.95% 22-JUL-2026
Issuer
Expand Lead Ltd.
Sector
Finance
Industry
Finance/Rental/Leasing
Issue date
Jul 22, 2021
FIGI
BBG011S3WQ79
Expand Lead Ltd. operates as a special purpose entity. The company is headquartered in Hong Kong.
Show more
EXLD5224111
analysis
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.
Start trial