Search
Products
Community
Markets
News
Brokers
More
EN
Get started
Markets
/
USA
/
Corporate bonds
/
MGSI5597044
M
M
M
Mobius Merger Sub, Inc. 9.0% 01-JUN-2030
MGSI5597044
FINRA
MGSI5597044
FINRA
MGSI5597044
FINRA
MGSI5597044
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Analysis
MGSI5597044
chart
Full chart
1 day
5 days
1 month
6 months
Year to date
1 year
5 years
All time
Key terms
Outstanding amount
500.00 M
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
9.00% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
9.65%
Maturity date
Jun 1, 2030
Term to maturity
5 years
About Mobius Merger Sub, Inc. 9.0% 01-JUN-2030
Issuer
Mobius Merger Sub, Inc.
Sector
Finance
Industry
Financial Conglomerates
Issue date
Jun 1, 2023
FIGI
BBG01GN87HT4
Mobius Merger Sub, Inc. is based in Wilmington, DE. Part of MOBIUS PARENT CORP., Mobius Merger Sub, Inc. is a company that provides financial solutions.
Show more
MGSI5597044
analysis
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.
Start trial