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TMJC5405183
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Analysis
T
T
T
STE TransCore Holdings, Inc. 3.375% 05-MAY-2027
TMJC5405183
FINRA
TMJC5405183
FINRA
TMJC5405183
FINRA
TMJC5405183
FINRA
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Overview
Analysis
TMJC5405183 analysis
Overview
Coupon
Redemption
Risks
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Key facts
Issuer
STE TransCore Holdings, Inc.
Issue date
May 5, 2022
Maturity date
May 5, 2027
Outstanding amount
700.00 M
USD
Face value
1,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
3.38% (Fixed)
Yield to maturity
4.70%
Part of Singapore Technologies Engineering Ltd., STE TransCore Holdings, Inc. provides engineering services. The company is based in Wilmington, DE.
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