Get started
TTT

ST Engineering RHQ Ltd. 4.25% 08-MAY-2030

No trades
See on Supercharts
Overview
Analysis

TMJC6073261 chart


Full chart

Key terms


Outstanding amount
‪750.00 M‬ USD
Face value
1,000.00 USD
Minimum denomination
200,000.00 USD
Coupon
4.25% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
4.44%
Maturity date
May 8, 2030
Term to maturity
4 years

About ST Engineering RHQ Ltd. 4.25% 08-MAY-2030


Issuer
ST Engineering RHQ Ltd.
Sector
Industrial Services
Industry
Engineering & Construction
Home page
stengg.com
Issue date
May 8, 2025
ISIN
XS3036581810
FIGI
BBG01TR0Z596

TMJC6073261 analysis


Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.

Dive into corporate with bonds that match in maturity and industry.