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Markets
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Hong Kong, China
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603259
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Corporate bonds
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WUXIF6034447
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Analysis
W
W
W
WuXi AppTec (HongKong) Ltd. 0.0% 19-OCT-2025
WUXIF6034447
FINRA
WUXIF6034447
FINRA
WUXIF6034447
FINRA
WUXIF6034447
FINRA
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Analysis
WUXIF6034447 analysis
Overview
Coupon
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Key facts
Issuer
WuXi AppTec (HongKong) Ltd.
Issue date
Oct 21, 2024
Maturity date
Oct 19, 2025
Outstanding amount
500.00 M
USD
Face value
100,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
0% (Zero)
Yield to maturity
−8.60%
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