Zhen Ding Technology Holding Limited 0.0% 24-JAN-2029Zhen Ding Technology Holding Limited 0.0% 24-JAN-2029Zhen Ding Technology Holding Limited 0.0% 24-JAN-2029

Zhen Ding Technology Holding Limited 0.0% 24-JAN-2029

No trades
See on Supercharts

Key terms


Outstanding amount
‪367.50 M‬USD
Face value
100,000.00USD
Minimum denomination
200,000.00USD
Coupon
0% (Zero)
Coupon frequency
Yield to maturity
1.28%
Maturity date
Jan 24, 2029
Term to maturity
4 years

About Zhen Ding Technology Holding Limited 0.0% 24-JAN-2029


Sector
Electronic Technology
Industry
Electronic Components
Home page
Issue date
Jan 24, 2024
FIGI
BBG01L160M71
Zhen Ding Technology Holding Ltd. engages in the production and sale of printed circuit boards. Its products include flexible printed circuits, high density interconnection circuit boards, rigid printed circuit boards, and integrated circuit substrates. The company was founded on June 5, 2006 and is headquartered in Taoyuan, Taiwan.
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.