UUU

T-MOBILE USA 2028

No trades
See on Supercharts
Overview
Analysis

US87264AAV7 analysis



Key facts


Issuer
T-Mobile USA, Inc.
Issue date
Jan 25, 2018
Maturity date
Feb 1, 2028
Outstanding amount
‪1.50 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
4.75% (Fixed)
Yield to maturity
5.08%
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.