Union Semiconductor (Hefei) Co., Ltd. engages in the provision of integrated circuit advanced packaging and testing services. It focuses on the development of chip on glass (COG) and chip on film (COF) technology in the field of display driver chip packaging and testing. The company was founded on December 18, 2015 and is headquartered in Hefei, China.
Fundamental metrics to determine fair value of the stock
Company’s recent performance and margins
Dividend yield, history and sustainability
Financial position and solvency of the company