3374 fundamentals
Key facts
Market capitalization—
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About
Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company was founded on September 11, 1998 and is headquartered in Taoyuan, Taiwan.
Valuation
Fundamental metrics to determine fair value of the stock
Growth and Profitability
Company’s recent performance and margins
Dividends
Dividend yield, history and sustainability
No dividends
3374 has never paid dividends and has no current plans to do so.
Financial health
Financial position and solvency of the company