333

XINTEC INC

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3374 fundamentals

Key facts

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About

Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company was founded on September 11, 1998 and is headquartered in Taoyuan, Taiwan.

Valuation

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Summary
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Dividends

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3374 does not pay dividends
The company has not previously paid dividends and at the moment there is no information about whether it is going to pay them in the future

Financial health

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