Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company was founded on September 11, 1998 and is headquartered in Taoyuan, Taiwan.
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Company’s recent performance and margins
Dividend yield, history and sustainability
Financial position and solvency of the company