XINTEC INCXINTEC INCXINTEC INC

XINTEC INC

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3374 fundamentals

Key facts

Market capitalization
Founded
CEO
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About

Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company was founded on September 11, 1998 and is headquartered in Taoyuan, Taiwan.

Valuation

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Summary
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Growth and Profitability

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Dividends

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No dividends
3374 has never paid dividends and has no current plans to do so.

Financial health

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