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6147 fundamentals

Overview Statements Statistics Dividends Earnings Revenue

Key facts

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About

Chipbond Technology Corp. engages in the manufacture of driver integrated circuits products. Its business activities include gold, solder and copper bumping, redistribution layer, wafer surface processing, wafer grinding and dicing, and packaging and testing services. The company was founded by Ming Shan Cheng on June 2, 1997 and is headquartered in Hsinchu, Taiwan.

Valuation

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Summary

No data available

There's currently no market capitalization, revenue or net income data to show.

Valuation ratios

Growth and Profitability

Company’s recent performance and margins

Dividends

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6147 does not pay dividends

The company has not previously paid dividends and at the moment there is no information about whether it is going to pay them in the future

Financial health

Financial position and solvency of the company