Winpac, Inc. engages in the provision of semiconductor packaging and test services. It operates through the following business divisions: Packaging (PKG) and Test. The Packaging business manufactures package and storage products such as fine pitch ball and land grid array, flip chip, universal serial bus flash and solid state drive. The Test business provides system-on-chip and memory test services. It also offers other services such as semiconductor design and simulation. The company was founded on April 3, 2002 and is headquartered in Yongin, South Korea.